Hoogtepunten van het product
- Specially positioned and dimensioned suction points enable safe handling of wet wafers
- Extremely fast and accurate handling thanks to low height and weight
- High suction capacity allows safe gripping even with partial occupancy or leakage e.g. with perforated wafers
- Controlled discharge of sucked air (optional) prevents contamination of the process area
- Quick release function enables precise wafer positioning