Process-safe handling of printed circuit boards and drilled PCBs
Simple separation of intermediate layers during loading and unloading of wet process equipment (e.g. final cleaning)
Use in the handling of inner layers for multilayers
Low-contact gripping of sensitive workpieces such as thin copper foils and substrates
Gentle handling of workpieces with slightly structured surfaces
Product Highlights
Operation without ejector due to integrated vacuum generation according to the Bernoulli principle
Low-contact handling due to "floating" suction cup on an air cushion
High leakage compensation thanks to high flow rate at low vacuum
Safe separation of thin, porous workpieces
Protection against uncontrolled electrostatic discharge by elastomer buffer made of NBR-ESD
Connection directly via four mounting threads on the top side (1); vertical (2) and horizontal compressed air connections
Conductive aluminium base body with integrated Bernoulli nozzle (3)
Flow element (4) in two versions: standard flow (SF) for dense to slightly porous parts and high flow (HF) with higher leakage compensation for porous parts
Dissipative elastomer buffers made of special material NBR-ESD on the underside of the suction cup (5)
Optional available with central support
Vacuum (A), exhaust-air (B)
Diameter: 10 to 100 mm
Holding force: 1.4 to 55.5 N
Rubber buffer to protect against uncontrolled electrostatic discharge
MetricImperial
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